无规共缩聚型聚酰亚胺薄膜的制备及性能研究  

Preparation and Properties of Random Copolymer Polyimide Film

作　　者：廖波[1] 张步峰[1] 汤海涛[1] 钱心远[1] 姜其斌[1] 

机构地区：[1]株洲时代新材料科技股份有限公司,湖南株洲412007

出　　处：《绝缘材料》2015年第8期33-35,40,共4页Insulating Materials

摘　　要：采用对苯二胺（p PDA）、4,4’-二氨基二苯醚（ODA）、均苯四甲酸二酐（PMDA）制备了p PDA/ODA-PMDA无规共缩聚型聚酰亚胺薄膜,研究了其树脂合成条件、亚胺化方式以及p PDA含量对PI膜性能的影响。结果表明：聚酰胺酸的黏度与反应温度成反比,化学亚胺法可以提高薄膜的热稳定性;随着p PDA含量的增加,PI薄膜的拉伸强度和尺寸稳定性得到明显改善。当p PDA含量为10%-15%时,PI薄膜的综合性能满足设计要求。A series of random copolymer polyimide films were prepared from pyromellitic dianhydride （pPDA）, 4,4＇-diaminodiphenyl ether（ODA）, and p-phenylene diamine （PMDA）, and the effects of synthsis condition of resin, imidization methods, and the pPDA content on their properties were studied. The results show that the viscosity was inversely proportional to temperature. The chemical imidization method could improve the thermal stability of PI film. With the increase of pPDA content, the tensile strength and dimensional stability of the PI films are improved obviously. When the pPDA content is 10%- 15%, the comprehensive properties of the PI films can satisfy the requirements.

关 键 词：无规共缩聚 聚酰亚胺薄膜 化学亚胺化 

分 类 号：TM215-3[一般工业技术—材料科学与工程]