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作 者:李祥东 张进成 邹瑜 马学智 刘畅 张苇杭 温慧娟 郝跃
机构地区:[1]Key Laboratozy of Wide Band Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071 [2]School of Electronic Science and Engineering, Nanjing University, Nanjing 210093
出 处:《Chinese Physics Letters》2015年第7期156-159,共4页中国物理快报(英文版)
基 金:Supported by the National Science and Technology Major Project of China under Grant No 2013ZX02308-002;National Natural Science Foundation of China under Grant Nos 11435010 and 61474086
摘 要:We report an AlGaN channel high electron mobility transistor (HEMT) on a sapphire substrate with a 1000-nm A1xGa1-xN (x = 0-0.18)/GaN composite buffer layer, With a significant improvement of crystal quality, the device features a high product orris. #n. The AIGaN channel HEMTs presented show improved performance with respect to the conventional AIGaN channel HEMTs, including the on-resistance reduced from 31.2 to 8.1 Ω.mm, saturation drain current at 2 V gate bias promoted from 218 to 540 mA/mm, peak transconductance at 10 V drain bias promoted from 100 to a state-of-the-art value of 174 mS/ram, and reverse gate leakage current reduced from 1.85 × 10-3 to 2.15 × 10-5 mA/mm at VOD = -20 V.We report an AlGaN channel high electron mobility transistor (HEMT) on a sapphire substrate with a 1000-nm A1xGa1-xN (x = 0-0.18)/GaN composite buffer layer, With a significant improvement of crystal quality, the device features a high product orris. #n. The AIGaN channel HEMTs presented show improved performance with respect to the conventional AIGaN channel HEMTs, including the on-resistance reduced from 31.2 to 8.1 Ω.mm, saturation drain current at 2 V gate bias promoted from 218 to 540 mA/mm, peak transconductance at 10 V drain bias promoted from 100 to a state-of-the-art value of 174 mS/ram, and reverse gate leakage current reduced from 1.85 × 10-3 to 2.15 × 10-5 mA/mm at VOD = -20 V.
关 键 词:AlGaN Channel High Electron Mobility Transistors with an Al_xGa x)N/GaN Composite Buffer Layer
分 类 号:TN386[电子电信—物理电子学]
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