机构地区:[1]School of Physics and Engineering,Institute of Power Electronics and Control Technology,Sun Yat-Sen University [2]State Key Laboratory of Optoelectronic Materials and Technologies,Sun Yat-Sen University
出 处:《Chinese Physics B》2015年第9期479-483,共5页中国物理B(英文版)
基 金:Project supported by the National Natural Science Foundation of China(Grant Nos.51177175 and 61274039);the National Basic Research Program of China(Grant Nos.2010CB923200 and 2011CB301903);the Ph.D. Programs Foundation of Ministry of Education of China(Grant No.20110171110021);the International Science and Technology Collaboration Program of China(Grant No.2012DFG52260);the National High Technology Research and Development Program of China(Grant No.2014AA032606);the Science and Technology Plan of Guangdong Province,China(Grant No.2013B010401013);the Opened Fund of the State Key Laboratory on Integrated Optoelectronics,China(Grant No.IOSKL2014KF17)
摘 要:The influences of dry-etching damage on the electrical properties of an AlGaN/GaN Schottky barrier diode with ICPrecessed anode was investigated for the first time. It was found that the turn-on voltage is decreased with the increase of dry-etching power. Furthermore, the leakage currents in the reverse bias region above pinch-off voltage rise as radio frequency(RF) power increases, while below pinch-off voltage, leakage currents tend to be independent of RF power.Based on detailed current–voltage–temperature(I–V –T) measurements, the barrier height of thermionic-field emission(TFE) from GaN is lowered as RF power increases, which results in early conduction. The increase of leakage current can be explained by Frenkel–Poole(FP) emission that higher dry-etching damage in the sidewall leads to the higher tunneling current, while below pinch-off voltage, the leakage is only related to the AlGaN surface, which is independent of RF power.The influences of dry-etching damage on the electrical properties of an AlGaN/GaN Schottky barrier diode with ICPrecessed anode was investigated for the first time. It was found that the turn-on voltage is decreased with the increase of dry-etching power. Furthermore, the leakage currents in the reverse bias region above pinch-off voltage rise as radio frequency(RF) power increases, while below pinch-off voltage, leakage currents tend to be independent of RF power.Based on detailed current–voltage–temperature(I–V –T) measurements, the barrier height of thermionic-field emission(TFE) from GaN is lowered as RF power increases, which results in early conduction. The increase of leakage current can be explained by Frenkel–Poole(FP) emission that higher dry-etching damage in the sidewall leads to the higher tunneling current, while below pinch-off voltage, the leakage is only related to the AlGaN surface, which is independent of RF power.
关 键 词:AlGaN/GaN Schottky barrier diodes recessed anode etching damage TUNNELING
分 类 号:TN311.7[电子电信—物理电子学]
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