降低固-固界面接触热阻研究  

Research on Reducing the Thermal Contact Resistance between Solid-Solid Interface

作　　者：吕晓卫[1] 冯展鹰[1] 冯杏梅[1] 金贵东[1] 

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2015年第4期37-40,共4页Electro-Mechanical Engineering

摘　　要：接触热阻是影响固-固界面之间传热的重要因素,文中研究了界面压力、接触面粗糙度、接触面平面度和在固-固界面添加导热介质等方式对固-固界面接触热阻的影响。研究显示在低压力水平和四角加压的方式下,降低接触面粗糙度和在接触面之间填充导热介质可以有效降低固-固界面的接触热阻。Thermal contact resistance is an important factor influencing the thermal conductivity between solid-solid interface.In this research,the influence of interface pressure,surface roughness,surface flatness and filling material are studied.It is found that under the condition of low pressure level as well as adding pressure at the four corners of the interface,reducing the surface roughness or adding filling material between the interface can reduce the thermal contact resistance between solidsolid interface effectively.

关 键 词：固-固界面 接触热阻 粗糙度 填充介质 

分 类 号：TK124[动力工程及工程热物理—工程热物理]