低熔点瓷化粉含量对陶瓷化聚烯烃材料性能的影响  

Influence of Addition of Low-Melting Point Filler on Properties of Ceramifying Polyolefine Composites

作　　者：邵海彬[1] 顾轩臣 王庭慰[2] 张尔梅[1] 王春丽[1] 

机构地区：[1]中利科技集团股份有限公司江苏省特种电缆高分子材料重点实验室,江苏常熟215542 [2]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电线电缆》2015年第5期20-23,共4页Wire & Cable

摘　　要：以聚乙烯、乙烯-辛烯共聚物为基体材料,以高、低熔点瓷化粉为瓷化填料,以乙烯基三甲氧基硅烷为表面处理剂,采用密炼及挤出工艺,研究了低熔点瓷化粉表面处理及添加量对材料拉伸性能、低温性能、加工性能、瓷化性能的影响。结果表明:表面处理能够明显提高材料的拉伸强度和断裂伸长率,改善材料的低温性能;随着低熔点瓷化粉添加量的增加,材料拉伸强度、断裂伸长率显著下降,脆化温度升高,加工性能变差,高温绝缘性下降,但瓷化性能提高。Ceramifying polyolefine composites were prepared by internal mixing and extrusion process using polyethylene and ethylene-octene copolymer as matrix materials,high and low melting point ceramifying powders as ceramifying additives,vinyltrimethoxysilane as surface treating agent. The influence of addition of low-melting point filler on tensile properties,brittle temperature,processing properties and ceramifying properties of composites were investigated. The result shows that tensile strength,elongation at break and brittle temperature can be increased by surface modification of low-melting point ceramifying powder; tensile strength,elongation at break,brittle temperature and electric insulation at high temperature can be decreased,flowability become worse,while ceramifying properties can be increased.

关 键 词：陶瓷化 聚烯烃 低熔点瓷化粉 

分 类 号：TM215.2[一般工业技术—材料科学与工程]