UBM凸点互连结构信号完整性分析  

Analysis of signal integrity of UBM and bump interconnection

作　　者：梁颖[1] 林训超[2] 黄春跃[3] 邵良滨 张欣[1] 

机构地区：[1]成都航空职业技术学院电子工程系,成都610021 [2]成都航空职业技术学院科技处,成都610021 [3]桂林电子科技大学机电工程学院,桂林541004

出　　处：《焊接学报》2015年第8期9-12,113,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2013GXNSFAA019322;2012GXNSFAA053234);四川省教育厅科研资助项目(13ZB0052)

摘　　要：建立了凸点下金属层(under bump metallization,UBM)和凸点互连结构仿真分析模型,基于HFSS软件对其高频条件下的信号完整性进行了研究.得到了UBM凸点互连结构表面电场强度分布,分析了UBM各层厚度及不同材料组合变化对UBM凸点互连结构信号完整性的影响.结果表明,不同信号频率下电场强度在凸点及UBM各层表面分布不均匀,越接近UBM顶端电场强度越大;随信号频率的提高,UBM凸点互连结构的回波损耗增大而插入损耗减小;随镍层厚度、铜层厚度和钛层厚度的增加插入损耗减小;采用Ti-Wu-Au组合UBM凸点互连结构的信号完整性最好,Ti-Cu-Ni组合次之,而Cr-Ni-Au组合最差.The simulation model of UBM bump interconnect structure was built. Its signal integrity under the high-frequency condition was studied based on HFSS software. The electric field strength distribution of UBM bump interconnect structure was obtained,the impact of UBM thickness and different material combinations on signal integrity of UBM bump interconnect structure was also studied. The results show that the electric field strength distributions on the bump surface and UBM under different frequencies are uneven,the more close to the top of UBM the stronger of the electric field strength is. The return loss of UBM bump interconnect structure increase as the signal frequency increases but the insertion loss decreases with the increase of the frequency. With the increase of the thickness of nickel layer,copper layer and titanium layer,the insertion loss decreases. The signal integrity of Ti-Wu-Au combination is the best,the Ti-Cu-Ni combination is the second and the Cr-Ni-Au combination is the worst.

关 键 词：凸点下金属层 电场强度 回波损耗 插入损耗 信号完整性 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术] TG454[自动化与计算机技术—计算机科学与技术]