SiC_p/Al激光诱导钎焊接头界面行为及性能  

Interface behavior and performance of laser induced brazing for SiCp/Al composite

作　　者：刘骏[1] 周广涛[1] 陈聪彬 牛济泰[2] 

机构地区：[1]华侨大学机电及自动化学院,厦门361021 [2]哈尔滨工业大学材料科学与工程学院,哈尔滨150001

出　　处：《焊接学报》2015年第8期43-46,115,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51245008);福建省科技平台建设资助项目(2013H2003);厦门市科技计划资助项目(3502Z20133023)

摘　　要：针对T/R模块壳体结构封装的特殊性,提出了激光诱导钎焊方法并建立其机理模型.以增强相体积分数为55%的Si CP/Al复合材料为母材,根据激光诱导温度场的特殊性,采用Al Zn25Si1,Zn Al7,纳米铝粉,微颗粒锡4种钎料对铝基复合材料进行了氩保护气氛钎焊试验,利用扫描电镜和EDS能谱分析的方法对钎焊接头的界面结合和断口形貌进行了研究.在保证接头材料表面不受热损伤、且搭接界面钎料熔化的特殊温度场的条件下,确定了激光的参数.结果表明,低熔点的Zn Al7、纳米铝粉钎料容易得到良好的接头,界面层通过扩散实现了冶金结合,断口分析表明,钎焊接头的断口位于钎缝偏于母材内一侧,具有一定的连接强度.Laser induced brazing was proposed in terms of the particularity of T / R module packaging structure. SiC p / Al composites containing 55% SiC p was chosen as base metals. According to the particularity of temperature field induced by laser,brazing test was conducted under Ar atmosphere, using four kinds of solder,including AlZ n25Si1, ZnA l7, nanometer Al powder and micro particles of Sn. The interfacial microstructures and fracture surfaces were investigated by SEM and EDS. Laser parameters were determined to ensure the composites surface be-ing free from thermal damage and molten solder interface. The results show that low melting solder ZnA l7 and nanometer Al powder were easy to obtain a better brazing joint,which can realize metallurgical bonding by diffusion. The fracture analysis indicates that the fracture lies on the base material side and has certain strength.

关 键 词：激光诱导 铝基复合材料 钎焊 界面行为 

分 类 号：TG456.7[金属学及工艺—焊接]