冷压烧结-热挤压复合工艺制备纳米SiC_P-Cu的组织、性能及耐磨性  

Microstructure and Properties of Nanometer SiC_P/Cu Matrix Composite Fabricated by Powder Metallurgy-hot Extrusion Compound Technology

作　　者：王保卫[1] 郑雷[2] 戴峰泽[3] 

机构地区：[1]鲁东大学交通学院,山东烟台264025 [2]盐城工学院机械工程学院,江苏盐城224051 [3]江苏大学机械工程学院,江苏镇江212013

出　　处：《热加工工艺》2015年第16期96-99,共4页Hot Working Technology

摘　　要：采用冷压烧结-热挤压复合加工工艺制备了纳米颗粒SiC增强铜基复合材料,研究了SiCP/Cu基复合材料的微观组织、显微硬度、力学性能、导电性能和耐磨性能。结果表明:采用本方法可获得组织致密的纳米SiCP/颗粒增强Cu基复合材料,纳米SiC颗粒以团聚状态分布在铜基体内;SiCP/Cu复合材料具有优良的导电性能和力学性能,可进行冷轧等二次加工;该复合材料的抗拉强度则有一个先升后降的过程,当纳米SiC颗粒含量增加到10%时,无法进行热挤压加工;该复合材料的耐磨性比工业纯铜好,但是比QCu差。The electric conductivity, vickers harness, tensile properties and sliding wear-resistance of SiCp/Cu composite with SiCp size of 30nm and volume content（0.5vol%-5vol%） fabricated by powder metallurgy followed by hot extrusion, were examined. The results show that the electric conductivity and fracture elongation decrease with the increase of SiCp content, and the tensile strength goes up first and then down, while the vickers harness increases with the increase of SiCp content. The sliding wear tests show that the wear performance of the composite is better than that of pure Cu but worse than QCu.

关 键 词：SICP/CU 基复合材料 纳米 SICP 热挤压 

分 类 号：TB331[一般工业技术—材料科学与工程] TG115.211[金属学及工艺—物理冶金]