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作 者:王小芳[1]
出 处:《热加工工艺》2015年第17期108-110,117,共4页Hot Working Technology
基 金:教育部科学技术研究重点资助项目(20512)
摘 要:采用计算机软件对Al-2%Cu二元合金的凝固微观组织进行了模拟,研究了界面换热系数、初始浇注温度、模具材料及厚度等工艺条件对铸造凝固微观组织影响。结果表明,随着界面换热系数的增加,合金凝固组织中柱状晶含量呈线性增加;随着浇注温度的升高,凝固组织由等轴晶向柱状晶转变,温度越高,柱状晶比例越大,当浇注温度为600℃时,合金凝固组织中几乎全部为等轴晶粒;当模具材料为硅砂时,合金凝固组织为粗大的等轴晶,使用钢制模具所得到的凝固组织为表层细晶区、柱状晶区及心部等轴晶,其中柱状晶组织占20%左右,而使用铜制模具时,柱状晶比率达60%;随着钢制模具厚度的增加,凝固组织中柱状晶比例快速增加。The solidification microstructures of Al-2%Cu binary alloy were simulated by using the computer simulation software. The influences of interfacial heat transfer coefficient, initial pouring temperature, mould material and thickness on the solidification microstructure were studied. The results show that with the increase of the interfacial heat transfer coefficient, the colunmar crystal content in the alloy solidification microstructure increases linearly. With the increase of pouring temperature, the microstructure changes from isometric crystal to columnar crystal. The higher the temperature, the greater the proportion of columnar crystal, and when pouring temperature is 600℃, the solidification microstructure is almost all isometric crystal. When the mold material is silica sand, the solidification microstructure is coarse isometric crystal; the solidification microstructure obtained by using the steel mold is surface fine grain zone, columnar crystal zone and core isometric crystal zone, in which columnar crystal is about 20%; and when using the copper mold, columnar crystal ratio is up to 60%. With the increase of the thickness of the steel die, columnar grain content in solidification microstructure increases quickly.
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