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作 者:王健[1] 郑非非[1] 董志刚[1] 康仁科[1] 刘津廷 郭东明[1]
机构地区:[1]大连理工大学精密与特种加工教育部重点实验室,大连116024
出 处:《金刚石与磨料磨具工程》2015年第4期60-65,共6页Diamond & Abrasives Engineering
基 金:国家重点基础研究发展计划(973计划)课题(2011CB013201);国家高技术研究发展计划(863计划)课题(2013AA040104);国家自然科学基金重大研究计划集成项目(91323302)
摘 要:反应烧结碳化硅(reaction bonded SiC,RBSiC)有着良好的物理和机械性能,在空间光学领域应用广泛。分别采用截面显微法和角度抛光法研究了金刚石砂轮磨削反应烧结碳化硅的亚表面损伤。实验结果表明:应用截面显微法能更直观地反映出损伤的形态和分布特征,角度抛光法测量损伤深度更为精确,亚表面损伤主要以凹坑和微裂纹的形式存在,主要发生在SiC颗粒上,且砂轮粒度对损伤影响很大。Reaction bonded silicon carbide (RBSiC) is widely used in space optics area for its brilliant physical and mechanical characters.In this paper,the grinding experiments of RBSiC were performed using a diamond grinding wheel.A cross-section microscopy method and an angle polishing method were used to detect subsurface damage separately.The results showed that the angle polishing method could measure the depth of damage more accurately,and that the cross-section microscopy method could reveal the topography of damage more clearly.Subsurface damage was mainly generated on SiC particles,and could be classified as two categories,namely pits closed to surface and large cracks. Grain grit has great influence on the depth of subsurface damage.
分 类 号:TG74[金属学及工艺—刀具与模具] TG58
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