基于多孔微热沉的大功率LED阵列散热实验及仿真优化设计  

Experimental Analysis and Optimization Design on Porous Micro Heat Sink for High Power LED Arrays

作　　者：刘靖[1] 王永翔[2,1] 万忠民[1,2] 常华伟[2] 陈曦[1] 罗良[1] 舒水明[2] 刘伟[2] 

机构地区：[1]湖南理工学院信息学院,岳阳414006 [2]华中科技大学能源与动力工程学院,武汉430074

出　　处：《工程热物理学报》2015年第9期2005-2009,共5页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.51106046;No.51376058)

摘　　要：对用于大功率LED阵列的多孔微热沉的主动冷却方案展开了实验研究,实验结果表明在输入功率为45 W的情况下,不采用多孔微热沉换热时,LED芯片温度在两分钟时间内就升高到了70℃;在采用多孔微热沉后,在50s系统就到达稳定,而且温度仅为38.3℃,即使功率加大到75 W,温度也仅为42.5℃。对多孔微热沉结构进行数值分析,结果表明,优化后的结构能提高LED散热效果,并极大的改善了基板的温度均匀性,有利于LED寿命和性能的提高。A series of experiments on an active cooling system that used the porous micro heat sink for thermal management of high power LED （light emitting diode） arrays had been conducted. The experimental results showed that in case of the LED power input of 45 W, the LED chip temperature raised up to 70℃ in two minutes without the porous micro heat sink. When the heat sink was used, the system reached stability in 50 seconds and the temperature was only 38.3℃. Even though the input is increased to 75 W, the temperature is merely 42.5℃. Numerical analysis on porous micro heat sink was conducted, the results indicated that the optimal structure could enhance the effect of heat dissipation and improved the temperature uniformity on the substrate, which is beneficial to the improvement of the life and performance of LED.

关 键 词：多孔微热沉 大功率LED 散热 优化 

分 类 号：TN312.8[电子电信—物理电子学]