一种无焊缝软圆波导仿真与测试  

Simulation and Test of a Corrugated Flexible Circular Waveguide Without a Soldering Slot

作　　者：梁铁柱[1,2] 黄文华[1,2] 朱四桃[1,2] 房金鹏[1,2] 江红 邓广淑 王颖[1,2] 李佳伟[1,2] 

机构地区：[1]高功率微波技术重点实验室,西安710024 [2]西北核技术研究所,西安710024 [3]零八一集团华昌电子有限公司,广元628000

出　　处：《现代应用物理》2015年第3期197-201,共5页Modern Applied Physics

摘　　要：采用光壁铜管直接压制的方法,研制了一种高功率微波无焊缝软圆波导,作为高功率微波源与发射平台之间的软连接馈线器件。仿真和测试结果表明,在满足端面二维方向移动范围大于5mm的要求下,该软圆波导的微波传输电压驻波系数小于1.1,传输圆波导TE11模和TM01模的模式畸变率均小于0.1dB,插入损耗小于0.15dB,功率容量大于3GW,满足高功率微波传输发射系统应用要求。A corrugated flexible circular waveguide was fabricated to link the HPM source and the transmission system. The simulation and test on the performance of the waveguide shows that, with the shift range of 5 ram, the waveguide has a power capacity more than 3 GW, an insertion loss less than 0.15 dB, and a VSWR lower than 1.1. For TE11 and TM01 mode, the mode aberration is less than 0.1 dB. The fabricated waveguide satisfies the requirements for the HPM transmission system.

关 键 词：高功率微波 功率容量 软圆波导 插入损耗 

分 类 号：TN814[电子电信—信息与通信工程]