高填量AlN/EP导热复合材料的制备与性能  

Preparation and Properties Analysis of High Loading AlN/EP Thermal Conductive Composites

作　　者：何庆[1] 秦明礼[1] 鲁慧峰[1] 曲选辉[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《真空电子技术》2015年第4期33-35,51,共4页Vacuum Electronics

摘　　要：以AlN粉末为填料,并对AlN进行表面处理,然后与环氧树脂进行共混,通过模压制备出AlN/EP导热复合材料。结果表明,复合材料的热导率和介电常数随着AlN填料含量的增加而升高,体积电阻率随着填料含量的增加而降低。将不同粒径和形貌的AlN粉末进行混合搭配,可以将AlN粉末的填充量提高到60%(体积比),热导率也随之提高到2.3 W/m·K。Used as filler, AtN powder was surface treated, blended with epoxy resin and processed by hot press molding to make thermal conductive composites. The results show that, with the increase of the content of AlN fillers, the thermal conductivity and dielectric constant of the composite increases, while the bulk resistivity decrease. By mixing AlN powders with different particle size and different morphology, the AlN volume fraction increases to 60%, and the thermal conductivity of the composites increases to 2.3 W/m. K.

关 键 词：氮化铝 环氧树脂 热导率 介电性能 

分 类 号：TQ174.6[化学工程—陶瓷工业]