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出 处:《真空电子技术》2015年第4期56-58,共3页Vacuum Electronics
摘 要:本文采用丝网印刷方法制备了某输能窗瓷片金属化层,并对丝网印刷和手工涂覆方法制备的金属化层的厚度、封接强度进行了对比。实验结果表明:丝网印刷方法适用于复杂形状陶瓷金属化,其膏层厚度均匀性和封接强度均优于手工涂覆。Screen printing method was used to prepare ceramics of microwave windows. The thickness and the sealing intension of metaUization layers prepared by screen printing and by manual coating were compared. The results show that screen printing is suitable for metallization of ceramics with complex shape, for the thickness uniformity and sealing strength of metallization layers made by screen printing was better than those made by manual coating.
关 键 词:陶瓷金属化 丝网印刷 复杂形状 封接强度 微观组织 输能窗
分 类 号:TB756[一般工业技术—真空技术]
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