聚碳酸酯/石墨烯微片纳米抗静电材料  

Polycarbonate/Graphene Nanoplatelet Antistatic Composites

作　　者：林湖彬 陈佳侠 杜崇铭 林志丹[2] 

机构地区：[1]惠州市昌亿科技股份有限公司,广东惠州516227 [2]暨南大学,广东广州510632

出　　处：《广东化工》2015年第17期7-8,4,共3页Guangdong Chemical Industry

摘　　要：采用聚碳酸酯（PC）为基体、石墨烯微片为导电剂、SEBS-g-MAH为增韧剂,经双螺杆挤出机熔融共混制备了电子元件装载用PC/石墨烯微片抗静电复合材料,研究了导电填料类型和含量、弹性体类型和用量、制备方法对复合材料的导电特性、微观形貌和力学性能的影响。结果表明,石墨烯微片含量在8~12 wt%时复合材料出现渗滤,SEBS-g-MAH的增容增韧效果优于MBS,一步法制备的材料性能比两步法的更好,PC/石墨烯微片/SEBS-g-MAH的最优质量比例为80/10/10。Polycarbonate/grapheme nanoplatelet antistatic composites for electronic components container were prepared by melt compounding process on a twin-screw extruder, using polycarbonate as matrix, grapheme nanoplatelet as conductive agent, SEBS-g-MAH as toughening agent. The effect of type and content of conductive agent, type and content of toughening agent, preparing methods on the conductive properties, microstructure and mechanical properties of the composites were studied. The results indicate that percolation occurres at the grapherne nanoplatelet content between 8 wt% and t2 wt%, and the compatibilizing and toughening effect of SEBS-g-MAH is better than MBS. The properties of the composites made by one step method surpassesd that of two steps method, and the optimal mass ratio of PC/grapheme nanoplatelet/SEBS-g-MAH is 80/10/10.

关 键 词：聚碳酸酯 石墨烯微片 抗静电 渗滤 

分 类 号：TQ323.41[化学工程—合成树脂塑料工业]