微带线阻抗不连续性的补偿研究  

Analysis of Compensation of Microstrip Line Impedance Discontinuity

作　　者：余文志 李晓磊[1] 吴柏昆 吴锋[1] 钱银博[1] 

机构地区：[1]华中科技大学光学与电子信息学院,湖北武汉430074

出　　处：《仪表技术与传感器》2015年第8期88-91,共4页Instrument Technique and Sensor

摘　　要：随着测试仪表板卡中传输信号频率的增加和上升时间变短,板卡中微带线与金手指宽度不一致引起的阻抗不连续问题对信号完整性的影响越来越严重。文中提出使用在参考地层构建反焊盘的方法对这种阻抗变化进行补偿,并使用高频结构仿真软件HFSS和高频电路仿真软件Ansoft Designer对单端和差分情况下的补偿效果进行时域和频域仿真。参数扫描仿真结果表明,通过选择合适的反焊盘面积,可以获得极佳的阻抗补偿效果,验证了该方法的可行性和有效性。该研究对实际PCB设计中类似问题的解决具有一定的参考价值。With the increase of transmission signal frequency and decrease of rise time on the testing instrument＇ s integrated circuit boards, the influence of the impedance discontinuity caused by the width difference between the microstrip line and bonding finger on signal integrity becomes more significant. In this paper, a method of constructing antipad on the reference strata was presented, which could compensate this impedance change. Time and frequency domain simulation for the case of single-ended and dif- ferential compensation were made with HFSS （high frequency structure simulation software） and Ansoft Designer （high frequency circuit simulation software）. The parameter scanning simulation results show that the best impedance compensation effect can be obtained by selecting suitable antipad size, which proved the feasibility and effectiveness of the method. The study has a certain reference value to solve the similar problem in the actual PCB design.

关 键 词：信号完整性 阻抗不连续 阻抗匹配 HFSS仿真 金手指 

分 类 号：TN41[电子电信—微电子学与固体电子学]