电镀金刚石工具新工艺  

New Technology of Preparation of Diamond Tool by Electroplating

作　　者：王琳[1] 黄志伟[2] 李云东[3] 孟普[1] 业红玲[1] 赵静[1] 

机构地区：[1]蚌埠学院机械与电子工程系,安徽蚌埠233030 [2]黄河水利职业技术学院,河南开封475004 [3]河南农业大学机电工程学院,河南郑州450002

出　　处：《电镀与环保》2015年第5期7-8,共2页Electroplating & Pollution Control

基　　金：蚌埠学院自然科学基金(No.2014ZR19;No.2013ZR02zd);蚌埠学院工程研究中心项目资金(No.BBXYGC2013B04)

摘　　要：利用自制薄膜将弱磁金刚石颗粒呈离散状态置于金属基体上,然后采用电镀方法制备出金刚石工具。金刚石颗粒有序分布,避免了偏析与聚集。弱磁金刚石可以实现颗粒与胎体界面间的化学键合,提高了对颗粒的把持力。Weak magnetic diamond particles were scattered on metal substrate discretely by using self-made thin film, and then diamond tool was prepared by electroplating. Diamond particles distribute orderly, and macrosegregation and aggregation situation was not appeared. Weak magnetic diamond can realize chemical bonding between particles and diamond tool matrix, thus improving the pullout strength.

关 键 词：弱磁金刚石 电沉积 有序分布 

分 类 号：TQ153[化学工程—电化学工业]