温敏树枝状聚合物研究进展  被引量:2

Progress in Thermoresponsive Dendritic Polymers

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作  者:王滨[1] 陈宇[1] 

机构地区:[1]天津大学理学院化学系,天津300072

出  处:《高分子通报》2015年第9期109-125,共17页Polymer Bulletin

基  金:国家自然科学基金资助(项目编号21274106)

摘  要:温度敏感型树枝状聚合物是智能材料的一个非常重要的分支,它不但具有温度刺激响应的特点,而且结合了树枝状聚合物高度支化、多官能度、低粘度等特点,在生物医用材料、智能催化剂、智能传感器、多功能材料等研究领域有着重要的研究价值和应用前景。该类聚合物的制备方法较为多样,在树枝状聚合物端基引入特定基团,或者调节分子骨架中亲水和疏水片段的比例均可以制备温敏树枝状聚合物。本文综述了不同结构温敏树枝状聚合物的制备方法、温敏机理及其在智能传感器、智能催化剂、多功能材料等方面的应用研究。Thermoresponsive dendritic polymer is one of the important sub-units of smart materials. It possesses not only the character of thermoresponsive properties, but also the characters of high branching degree, high functionality, low viscosity etc. Such characters endow thermoresponsive dendritic polymers to attract wide attention and show wide potential applications in many fields, such as biomedical materials, smart catalysts, smart sensors, multifunctional materials. The synthetic methods of preparing such thermoresponsive dendritic polymers are versatile, which includes the introduction of specific units into the terminal groups of dendritic polymers or the variation of the ratio of the hydrophilic and hydrophobic units in the backbone of the polymers. This article reviews the preparation routes of different thermoresponsive dendritic polymers, their thermoresponsive mechanism and their potential applications in smart sensors, smart catalysts and multifunctional materials.

关 键 词:树枝状聚合物 超支化聚合物 树形大分子 温敏聚合物 低临界溶解温度 

分 类 号:O631.1[理学—高分子化学]

 

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