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作 者:唐玲[1]
机构地区:[1]陕西理工学院南区材料学院,陕西汉中723003
出 处:《铸造》2015年第9期856-860,共5页Foundry
基 金:陕西省科技厅基金(2011JE009);陕西理工学院校级项目(slgky13-49)
摘 要:基于BH模型和最高界面生长温度的判据,对定向凝固过程中非共晶点Al-Cu合金中各相的凝固界面温度进行了理论计算,探讨了耦合共晶和初生枝晶之间的竞争生长,发现在共晶共生区,非共晶点成分的Al-Cu合金仍可以耦合生长,给出了耦合生长的临界速率,并通过origin 8.0软件绘制出Al-Cu合金的耦合共生区,并通过Al-38.5%Cu合金在不同的定向凝固速率下的试验结果分析,理论预测的临界速率与试验的结果基本一致。Abstract: The solidification interface temperatures of α, β and eutectic phases at different growth rates in Al-Cu alloys have been analyzed based on the maximum interface growth temperature criteria and BH theoretical model. The competitive growth in eutectic phase and primary dendrite phase have been studied. The results showed that the non- eutectic point Al-Cu alloys could coupled growth in the couple growth zone. The critical speed of couple growth were given. The couple growth zone of Al-Cu alloy were pictured using by origin 8.0 software, the experiment result of different directional solidification rate of Al-38.5%Cu hypereutectic alloy was analyzed, a good agreement between the theoretical calculation results and experimental data has been achieved.
分 类 号:TG146.21[一般工业技术—材料科学与工程]
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