高精度分体式超声波温度测量仪研究  

The Study of A High-Precision Split Ultrasonic Temperature Measuring Instrument

作　　者：张兴红[1,2] 陈鑫[1,2] 蒋洪庆 何涛[1,2] 

机构地区：[1]重庆理工大学机械检测技术与装备教育部工程研究中心 [2]时栅传感及先进检测技术重庆市重点实验室,重庆400054

出　　处：《传感技术学报》2015年第9期1389-1394,共6页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金项目(51275551);重庆市自然科学基金项目(cstc2012jj A70004;cstc2012jj A40062);重庆理工大学研究生创新基金项目(YCX2014222)

摘　　要：传统的温度测量仪在较宽的测量范围内无法保证稳定的高精度测量,针对此种不足,设计了一种高精度分体式多声道超声波温度测量仪。该温度测量仪利用超声波测温技术,以被测物体作为传播媒介,在传播距离确定的条件下,通过测得超声波在介质中的传播时间间接测得介质的温度。分体式多声道的结构设计使温度测量准确有效,同时降低了传感器材质在耐高温、耐腐蚀方面的限制要求。基于FPGA的快速处理电路以及细分插补算法,使传播时间的测量分辨率优于纳秒级,确保实现分辨率优于0.001℃的高精度温度测量。Traditional temperature measurement instruments cannot assure the stability of high precision in wide measurement range, a high-precision split ultrasonic temperature measuring instrument is designed aiming to solve the defects. The ultrasonic temperature measurement technology is introduced. The material stored in vessel is used as the medium of ultrasonic propagation. The medium＇s temperature is measured indirectly by measuring the propa- gation time of ultrasonic wave when the propagation distance is certain. The structure of split and multichannel type is helpful to make the measuring result more accurate and reliable. The special structure can lower requirements of material resistance to high temperature and corrosion. The fast data processing circuit based on the FPGA and sub- division interpolation algorithm can ensure the measurement resolution of propagation time achieve nanosecond lev- el. The ultrasonic thermometer can realize high precision temperature measurement with the resolution better than 0.001℃.

关 键 词：精密测量 超声波测温 分体式 细分插补 

分 类 号：TP216[自动化与计算机技术—检测技术与自动化装置]