半导体制冷热端热管式散热器的研究  

Heat pipe radiator used in hot side semiconductor refrigeration

作　　者：曹旭[1] 王宝田 李菊香[1] 

机构地区：[1]南京工业大学能源学院,江苏南京211800 [2]中海油山东海化集团热电分公司生产技术部,山东潍坊262737

出　　处：《南京工业大学学报（自然科学版）》2015年第5期122-126,共5页Journal of Nanjing Tech University(Natural Science Edition)

基　　金：江苏省科技计划(BK2004214)

摘　　要：对半导体制冷片热端的热管散热系统进行模拟计算和实验研究。结果表明:半导体制冷片热端表面温度和热管工作温度随环境温度的升高而升高、随雷诺数(Re)的增大而降低、随半导体制冷功率的增加而升高。热管散热器有效改善了半导体制冷片热端的散热条件,使半导体制冷片热端表面温度大幅降低,提高半导体制冷片的制冷性能。拟合出了半导体制冷片热端热管散热器冷凝段管外对流散热的努赛尔数(Nu)随Re数和普朗特数(Pr)传热关联式Nu=0.663 5Re0.496 6Pr1/3。Numerical simulation and experiments were held on heat pipe radiator used in hot side semiconductor refrigeration. Results showed that the surface temperature of the hot side semiconductor and the operating temperature of the heat pipe increased with the environmental temperature,decreased with the number of Reynolds（ Re） and increased with the refrigeration power of the semiconductor. The heat pipe radiator improved the heat radiating condition of the hot side semiconductor effectively,thus it could decrease the hot side temperature and promote the refrigerating property obviously. The relation of outer tube convection number of Nussetl（ Nu） with Re and the connection number of Prandtl（ Pr） for the hot side semiconductor refrigeration Nu = 0. 663 5 Re^0. 496 6Pr^1/3 was fitted from numerical simulation and experimental data.

关 键 词：半导体制冷 热管式散热器 数值模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理]