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作 者:Xue-Qing Han Qun-Feng Zhang Feng Feng Chun-Shan Lu Lei Ma Xiao-Nian Li
出 处:《Chinese Chemical Letters》2015年第9期1150-1154,共5页中国化学快报(英文版)
基 金:Funding for the present study from the National Key Basic Research Program of China(973 Program,No.2011CB710800);National Natural Science Foundation of China(No.NSFC21406199)
摘 要:Cu/SiO2 catalysts prepared by different methods have been investigated focusing on the influence of Cu^+on the catalytic performance.The composition,structure and copper valence state were characterized by means of BET,XRD,XPS,FTIR,N2O-titration.It was found that the Cu/SiO2 prepared by ammoniaevaporation(AE) method had much higher TOF value than that prepared by wetness-impregnation(WI)with the same THF selectivity.The higher TOF value was attributed to the coexistence of Cu^+ and Cu^0species in the activated AE-Cu/SiO2.while only Cu° species existing in the activated Wl-Cu/SiO2.Researches suggest that Cu^+ can adsorb and polarize the C=0 bond of DMM.It is concluded that Cu°could be the main active site and the synergistic effect between Cu^0 and Cu^+ could contribute to hydrogenation of DMM to THF.Cu/SiO2 catalysts prepared by different methods have been investigated focusing on the influence of Cu^+on the catalytic performance.The composition,structure and copper valence state were characterized by means of BET,XRD,XPS,FTIR,N2O-titration.It was found that the Cu/SiO2 prepared by ammoniaevaporation(AE) method had much higher TOF value than that prepared by wetness-impregnation(WI)with the same THF selectivity.The higher TOF value was attributed to the coexistence of Cu^+ and Cu^0species in the activated AE-Cu/SiO2.while only Cu° species existing in the activated Wl-Cu/SiO2.Researches suggest that Cu^+ can adsorb and polarize the C=0 bond of DMM.It is concluded that Cu°could be the main active site and the synergistic effect between Cu^0 and Cu^+ could contribute to hydrogenation of DMM to THF.
关 键 词:Dimethyl maleate Tetrahydrofuran Copper phyllosilicate Silica-supported copper Copper valence state
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