铜热浸镀铝的组织与性能  

Microstructure and Performance of Hot-Dip Aluminizing Coating of Copper

作　　者：王征[1] 刘平[1,2] 刘新宽[2] 陈小红[2] 何代华[2] 马凤仓[2] 

机构地区：[1]上海理工大学机械工程学院,上海200093 [2]上海理工大学材料科学与工程学院,上海200093

出　　处：《稀有金属》2015年第10期955-960,共6页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(51201107);上海市教委科研创新项目(11YZ112);上海市科委基础重点项目(10JC1411800)资助

摘　　要：采用一浴法对铜进行了热浸镀镀铝试验,热浸镀时间为8s,热浸镀温度为690~740℃。研究了热浸镀温度对Cu/Al复合材料组织、导电性能及结合性能的影响,采用扫描电子显微镜（SEM）和偏光显微镜（PM）观察双金属结合界面金相组织形貌,用能谱仪（EDS）进行化学成分分析,用X射线衍射仪（XRD）进行物相分析。结果表明：随着热浸镀温度的升高,Cu/Al复合材料导电性能迅速降低;结合性能出现先升高后降低的趋势。在热浸镀温度为710℃、热浸镀时间为8s的条件下,Cu/Al复合材料过渡层的金属间化合物晶粒比较小而且分布较均匀,相比温度升高获得的粗大晶粒而言更有弥散强化优势,并且有利于应力的缓解释放,此时Cu/Al复合材料结合强度最高,达到了最大的16MPa,过渡层内形成了良好的结合界面;Cu/Al复合材料界面主要生成了CuAl2,CuAl,Cu9Al4,K3AlF6等化合物,但金属间化合物过多会对缺陷比较敏感,易产生裂纹,严重影响Cu/Al复合材料的导电性和结合性。Cu/Al复合材料的界面结构为Cu/Cu-Al化合物＋Cu基固溶体/Al-CuAl2共晶组织＋Cu-Al化合物＋Al基固溶体/Al。Hot-dip aluminizing of copper was done through one-bath with hot-dip time of 8 s and hot-dip temperature of 690 ~ 740 ℃. The effects of hot-dip temperature on microstructure, conductivity and bonding of Cu/A1 composite were studied. The microstrue- ture and the morphology of Cu/A1 composite were observed by scanning electron microscope （SEM） and polarizing microscope （ PM）, the chemical composition was analyzed by energy dispersive spectrometer （EDS） , and the phases were determined by X-ray diffractom- eter （XRD）. The results showed that with the hot-dip temperature increasing, the conductivity of Cu/A1 composite decreased rapidly and the bonding of Cu/A1 composite increased at first and decreased later. At 710 ℃, with hot-dip time of 8 s, all kinds of phases were distributed uniformly, and no coarsening occurred yet, it had distribution advantages over coarse phases which were obtained by raising temperature, and had a function of dispersion strengthening, and contributed to the release of stress, and the bonding strength was the highest （ 16 MPa） at this time, indicating the formation of well bonded interface. The main reaction products of Cu/A1 compos- ite were CuA12, CuA1, Cu9A14 and K3AIF6, but excessive Cu-A1 compounds were more sensitive to defects, easy to produce cracks and reduce bonding. The interfacial microstructure of Cu/A1 composite was Cu solid/Cu-A1 compound ＋ Cu solid solution/A1 solid solution ＋ Cu-A1 eutectic ＋ Cu-A1 compound/Cu solid.

关 键 词：铜 铝 热浸镀 导电性能 结合性能 

分 类 号：TB331[一般工业技术—材料科学与工程]