Packaging investigation of optoelectronic devices  

作　　者：张志珂 刘宇 刘建国 祝宁华 

机构地区：[1]State Key Laboratory on Integrated Optoelectronics,Institute of Semiconductors,Chinese Academy of Sciences

出　　处：《Journal of Semiconductors》2015年第10期3-8,共6页半导体学报（英文版）

基　　金：Project supported by the National High Technology Research and Development Program of China(Nos.2013AA014201,2013AA014203);the National Natural Science Foundation of China(Nos.61177080,61335004,61275031)

摘　　要：Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.

关 键 词：optoelectronic packaging PIC butterfly packaging 

分 类 号：TN05[电子电信—物理电子学]