基于ManixFP成形系统的集成电路引线成形工艺  

IC Lead-forming Process Based on Manix FP System

作　　者：王玉龙[1] 刘剑[1] 张艳鹏[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电子工艺技术》2015年第5期269-272,共4页Electronics Process Technology

基　　金：国家自然科学基金资助项目(项目编号:No.60507003)

摘　　要：直引线器件是目前高可靠性产品中使用较多的一种封装形式,需要对其进行二次成形处理,而成形过程对PCB焊盘设计、成形工艺的掌控以及设备的状态提出了较高的要求,因此有必要对器件的引线成形工艺过程进行系统的归纳和总结。介绍了"ManixFP"系列单边可调双工位集成电路引线成形设备的结构组成及工作原理,分析和总结了设备在使用过程中应关注的工艺要点,设计了专用的核算软件,对成形的尺寸参数进行预先评估,确保成形质量。Straight lead device is a kind of package widely used in the products of high reliability at present, but it needs to be formed by another process, and the forming process needs higher requirements on PCB pad design, process control and process equipment. So it is necessary to conclude and summarize about lead-forming process of the device. Describe the structure and working principle of equipment about the mould of Manix FP series of adjustable single side and double station, analyze and summarize the key point that should pay attention in the process, design a special software to pre-evaluate the formation size, ensure the forming quality.

关 键 词：Manix FP 集成电路 引线成形 单边可调双工位 

分 类 号：TN605[电子电信—电路与系统]