电子制造业中的三防涂覆技术  

Protection and Coating Technology of PCBA in Electronic Assembly Field

作　　者：鲜飞[1] 刘江涛[1] 易亚军[1] 胡少云[1] 杨巍[1] 

机构地区：[1]武汉华中数控股份有限公司,湖北武汉430223

出　　处：《电子工艺技术》2015年第5期278-280,共3页Electronics Process Technology

基　　金：科技重大专项基金项目(项目编号:2012ZX04001-022)

摘　　要：在恶劣环境下工作的电子设备,其线路板组件易受盐雾、潮气和霉菌的影响而引发系统故障,因此线路板组件的三防涂覆技术成为电子组装领域备受关注的工艺技术。重点介绍三防涂覆工艺的原理、关键工艺参数,分析三防涂覆的一些常见工艺问题及解决办法,最后对选择性涂覆设备进行了简要介绍。PCBA of electronics equipment under due to the influence of environment factors such as bad working conditions is easy to occur malfunction salt frog, humidity, mildew etc. So the protection and coating technology of PCBA has been become the important technology in electronic assembly field. Mainly introduce protection and coating technology and key parameters, and analyse some common problems and solve methods. At last, briefly introduce the selective coating equipment.

关 键 词：三防 涂覆 涂覆设备 线路板组件 

分 类 号：TN605[电子电信—电路与系统]