军用短引脚陶瓷封装PGA装联工艺技术研究  

Study of Soldering Technology of Military Short Lead Ceramic Pin Grid Array

作　　者：张艳鹏[1] 王玉龙[1] 张伟[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电子工艺技术》2015年第5期281-282,298,307,共4页Electronics Process Technology

摘　　要：在常规通孔插装器件焊接工艺的基础上,增加底风预热系统,实现军用短引脚陶瓷封装针栅阵列(CPGA)的高可靠性手工组装。以通孔透锡率和焊点气泡率为判据,探讨了底风预热系统、烙铁头选择以及助焊剂使用对焊点结构的影响规律,最终确定适用于短引脚CPGA的手工装联工艺技术。The high reliability soldering process of military short lead ceramic pin grid array （CPGA） was achieved by adding bottom wind pre-heating system on the basis of normal THT soldering technology. The THT filling rate and void rate were used as the inspect standard, in order to investigate the influence of pre-heating system, soldering iron head and flux on THT solder joint structure. The suitable hand soldering technology for the short lend CPGA was determined finally.

关 键 词：CPGA 底风预热 手工装联 透锡率 气泡率 

分 类 号：TN605[电子电信—电路与系统]