微晶玻璃亚表面损伤深度测量技术及控制试验研究  被引量:1

Experimental Study on Measurement and Controlling of the Depth of Subsurface Damage of Glass-Ceramic

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作  者:向勇[1] 任杰[1] 白满社[1] 陈勇[1] 陈静[1] 张晋宽[1] 

机构地区:[1]中航工业西安飞行自动控制研究所

出  处:《航空制造技术》2015年第19期18-21,25,共5页Aeronautical Manufacturing Technology

摘  要:针对微晶玻璃材料研磨加工引入的亚表面损伤层,综合使用磁流变抛光斑点技术和HF酸差动化学蚀刻速率法测量亚表面裂纹层深度和亚表面残余应力层厚度,针对微晶玻璃材料抛光加工引入的亚表面损伤,采用蚀刻台阶高度变化率法对其进行了准确测量。基于研磨、抛光产生的亚表面损伤深度准确检测的基础上,提出一种超低亚表面损伤复合加工工艺。将复合工艺与传统工艺加工试件的亚表面损伤深度进行了对比,试验结果表明,复合工艺对亚表面损伤抑制效果非常明显,试验证实了提出的复合工艺可以实现微晶玻璃超低亚表面损伤加工。For the subsurface damage layer of glass-ceramic materials in grinding process, a combined method of MRF spot technique and HF acid differential chemical etch rate method is proposed to measure the depth of subsurface crack layer and thickness of residual stress layer, For the subsurface damage layer of glass- ceramic materials in polishing process, a method of etch bench height change is proposed to measure the depth of subsurface layer. A combined method of super-low sub- surface damage is proposed on the basis of accurate detec- tion of subsurface damage depth caused by lapping and polishing. Through comparison between the depth of sub- surface damage processed by combined method and tradi- tional method, the result showed that combined method for the suppression effect of subsurface damage is more ob- vious, the super-low sub-surface damage of glass-ceramic is acquired by the combined method is proved through the experiment.

关 键 词:亚表面损伤 残余应力 研磨 抛光 磁流变抛光 

分 类 号:TQ171.733[化学工程—玻璃工业]

 

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