LaNd含量对Zn9.3Al7Cu钎料熔点及硬度的影响  

Impact of LaNd content on melting point and hardness of Zn9.3Al7Cu solder

作　　者：马士涛[1] 闫焉服[1] 朱锦洪[1] 王红娜[1] 赵永猛[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003

出　　处：《焊接技术》2015年第8期49-52,2,共4页Welding Technology

基　　金：国家自然科学基金(51175151)

摘　　要：采用合金化原理,向Zn9.3Al7Cu基体钎料中添加混合稀土La Nd,制备出新型钎料合金。研究了La Nd含量对Zn9.3Al7Cu钎料熔点、布氏硬度、显微硬度的影响。结果表明:钎料合金熔化温度随着稀土含量的增加而提高,但增幅不大;当w(La Nd)0.1%时,Zn9.3Al7Cu0.1La Nd钎料合金的固液相熔化区间最窄,为37℃,较基体钎料减少7℃;随着La Nd添加量的增加,Zn9.3Al7Cu钎料合金的布氏硬度和显微硬度均提高;当w(La Nd)0.5%时,Zn9.3Al7Cu0.5La Nd钎料合金的布氏硬度和显微硬度最高,分别较基体钎料的提高了4.1%和6.2%。A new solder was made by adding trace LaNd into Zn9.3Al7 Cu alloy to study the melting point,brinell hardness and microhardness.The results turned out that Zn9.3A17 CuxLaNd solder's melting point increased gradually with the increase of LaNd content,but the increment was a litter,the melting range of solid-liquid phase of Zn9.3Al7Cu0.1 LaNd solder was 37 ℃,decreased 7 ℃ compared with Zn9.3Al7 Cu solder when content of LaNd was0.1%,brinell hardness and microhardness of Zn9.3Al7 Cu solder added with the increase of LaNd content,the hrinell hardness of Zn9.3Al7Cu0.5LaNd solder increased 4.1%than the substrate solder and the microbardness of Zn9.3Al7Cu0.5LaNd solder increased 6.2%than the substrate solder when ω(LaNd) was 0.5%.

关 键 词：Zn9.3Al7Cu钎料 熔点 布氏硬度 显微硬度 

分 类 号：TG425.1[金属学及工艺—焊接]