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作 者:张红爱[1] 王学杰[1] 伍仕文 伍洪[1] 胡靓[1]
机构地区:[1]中国振华电子集团有限公司,贵州贵阳550018
出 处:《贵州大学学报(自然科学版)》2015年第4期51-54,59,共5页Journal of Guizhou University:Natural Sciences
基 金:军民融合专项(筑工信发[2014]120号)
摘 要:随着科学技术的不断发展,陶瓷产品的应用日益广泛。一些小体积、高性能、高可靠陶瓷基片在高端装备领域越来越发挥重要作用,给模具设计、加工以及陶瓷坯片成型工艺带来了新的课题。本文研究了在瓷料配方不变的条件下,从模具材料的选用、不同成型方式、坯体密度、压力、加压速度对小型化陶瓷产品各项电性能的影响,优选最佳模具材料加工模具,使成型方式得到致密度较好的陶瓷坯体,获得了小型化、高性能、高可靠的电子陶瓷产品。With the continuous development of science and technology, the ceramic products are becoming more and more widely used. The small volume, high performance, high reliability ceramic substrate increasingly plays an important role in the field of high - end equipment field, and brings new topics to the mold design, mold pro- cessing, and the molding technology of ceramic billet pieces. Under the condition of without changing ceramic formula, the selection of mould materials, different ways of molding, body density, pressure and speed of apply- ing pressure on the miniaturization were studied to influence the various electrical properties of process the mould, and the best way of molding was chosen to tion, high performance, high reliability electronic duces upgrading and promote industrial upgrading get the better body density of ceramic billet. The miniaturiza- ceramic, was obtained, which plays the proper role for pro- of the enterprise.
分 类 号:TN605[电子电信—电路与系统]
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