交联壳聚糖树脂的制备及其对Cu^(2+)吸附性的研究  

The Preparation of Crosslinked Chitosan Resin and Its Property on Cu^(2+) Adsorption

作　　者：王铮[1] 付岩[1] 

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《电镀与精饰》2015年第10期44-46,共3页Plating & Finishing

摘　　要：以壳聚糖为原料,制成壳聚糖微球,再经过环氧氯丙烷交联得到羟丙基氯壳聚糖微球。实验研究了2.8%壳聚糖醋酸溶液,致孔剂20%无水乙醇,15%氢氧化钠,壳聚糖与环氧氯丙烷质量比为2∶1,反应θ为50℃,反应t为4 h,得到最好的羟丙基氯壳聚糖微球。当溶液pH=6时,振荡θ为30℃,振荡t为60 min,对Cu2+有最大吸附量。Hydroxypropyl chlorine chitosan microspheres（ CLC） were made by crosslinking chitosan microspheres and epichlorohydrin（ ECH）. The optimum CLC were obtained in the condition including 2. 8% solution of chitosan acetic acid,20% of pore former ethanol,15% sodium hydroxide solution,chitosan and ECH ratio of 2 ∶ 1,reaction temperature 50 ℃,reaction time 4 h. The maximum adsorption of Cu2＋ was achieved at pH value of solution 6,oscillation temperature of 30 ℃ with oscillation time for 60 min.

关 键 词：壳聚糖 羟丙基氯壳聚糖 铜离子 吸附 

分 类 号：X703[环境科学与工程—环境工程]