石墨-铜扩散连接的界面行为  

Interface behaviors of C/Cu by diffusion bonding

作　　者：李启寿[1] 程亮[1] 杨勇[1] 朱益军[1] 蔡永军[1] 李强[1] 

机构地区：[1]中国工程物理研究院,绵阳621900

出　　处：《粉末冶金材料科学与工程》2015年第5期732-737,共6页Materials Science and Engineering of Powder Metallurgy

摘　　要：以Ag Cu Ti合金粉末为过渡层,采用扩散连接法对石墨与铜进行扩散连接实验。利用X射线衍射仪、扫描电镜、金相显微镜及万能材料实验机对连接界面的性能及微观形貌进行研究。研究结果表明:在工艺参数为870℃/200 k Pa/10 min的条件下可实现石墨-Cu连接,其接头界面组织结构为石墨/Ti C/铜基固溶体+富银区/铜;接头剪切强度为17 MPa,断裂在石墨母材;并分析了石墨/Ag-Cu-Ti/铜真空加压烧结接头的形成机理。The graphite and copper were jointed by diffusion bonding method, using AgCuTi alloy powders as the transit layer. The mechanical properties and microstructure of the bonding surface were investigated by SEM, EDS, XRD, OM and shearing test, the forming mechanism of graphite/Ag-Cu-Ti/Cu joint sintered in vacuum pressure condition was also analyzed. The result shows that the joint of graphite and copper could be realized at 870 ℃/200 kPa/10 rain. The typical interfacial microstructure of the joints is graphite/TiC/Cu solid solution＋Ag-rich region/Cu. The shear strength of the specimens is 17 MPa, and the fracture takes place in the graphite matrix.

关 键 词：石墨 铜 连接 界面结构 

分 类 号：TG146.11[一般工业技术—材料科学与工程]