Ni-Cu多孔薄膜的制备及造孔机理  

Preparation and mechanism of fabricating Ni-Cu porous membrane

作　　者：喻博闻[1] 江垚[1] 周邦鸿 贺跃辉[1] 王世良[2] 

机构地区：[1]中南大学粉末冶金研究院,长沙410083 [2]中南大学物理与电子学院,长沙410083

出　　处：《粉末冶金材料科学与工程》2015年第5期760-764,共5页Materials Science and Engineering of Powder Metallurgy

基　　金：科技支撑计划(2012BAC02B05)

摘　　要：以金属铜箔和镍粉为原料,采用涂覆法制备出Ni-Cu多孔薄膜。采用场发射扫描电子显微镜(FE-SEM)、X射线衍射仪(XRD)、原子力显微镜(AFM)等设备对所制Ni-Cu薄膜的显微结构、物相组成进行表征。通过压泡法对所制多孔薄膜的通量及孔径进行测试,并探讨薄膜的成孔机理。研究表明:所制备Ni-Cu多孔薄膜厚度约为50μm,平均孔径约10μm;涂覆面通过Ni粉的松装烧结形成多孔结构;铜箔一测的孔是由于Kirkendall效应所产生的空位沿着晶界扩散在表面聚集而成。Ni-Cu porous thin membrane was fabricated by slurry coating method using copper foil and nickel powders as raw materials. Field emission scanning electron microscopy （FE-SEM）, X-ray diffraction （XRD）, and atomic force microscope （AFM） were used to characterize the compositions and structures. Information of permeability and pore size was unveiled by bubbling method. And the formation mechanism of pores on membrane was discussed. Based on the results tested above, the thickness of porous membrane is about 50 μm with pores of 10 μm in diameter; pores on coating side are from free sintering; and voids on the foil side are derived from vacancies generated by Kirkendall effect, diffused along the grain boundaries and then sunk on the surface of Cu foil.

关 键 词：Ni—Cu 多孔材料 Kirkendall效应 

分 类 号：TG146[一般工业技术—材料科学与工程]