低温固化导电银浆的流变性研究  

Rheology of Silver Paste Cured at Low Temperature

作　　者：许巍[1] 崔佳垠 李森[1] 钱军[1] 李欣欣[1] 袁晓[1] 

机构地区：[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237

出　　处：《华东理工大学学报（自然科学版）》2015年第5期623-628,共6页Journal of East China University of Science and Technology

基　　金：国家“863”计划项目(2014AA0521012)

摘　　要：研究了气相二氧化硅、聚酰胺蜡粉、改性聚脲3种不同流变助剂对银浆性能的影响,通过应力扫描、频率扫描、印刷模拟等振荡剪切动态扫描,分析了不同流变助剂对银浆流变性的影响,并建立了银浆流变性与印刷性之间的联系。结果表明,随着改性聚脲用量的增加,浆料内部的氢键增多,形成的立体交联网络的粒子间相互作用力增强,导致黏度上升,屈服应力增大,损耗角下降,恢复速度加快。当改性聚脲用量(质量分数)为1.5%时银浆印制的导电膜层扩散小、轮廓清晰、分布均匀、线型良好。In this paper, the effects of three rheological additives including fumed silica, polyamide powder and modified polyurea on the rheologocial properties of silver paste were studied by means of stress sweeping, frequency sweeping, and printing simulation oscillation shear dynamic sweeping. The correlation between paste rheology and printability was established. The results showed that with the increase of modufied polyurea, the internal hydrogen bonding of silver paste was increased, the interactions among particles to form three-dimensional crosslinking network was enhanced, resulting in the increase of viscosity and the yield stress as well as the decrease of the loss angle and the enhancement of recovery speed. Silver paste with 1.5% dosage（mass fraction） of modified polyurea showed a fine line with small diffusion, sharp edge, uniform distribution, and good line type.

关 键 词：低温银浆 流变性 流变助剂 印刷性 

分 类 号：TM241[一般工业技术—材料科学与工程] TB34[电气工程—电工理论与新技术]