铜电解沉积过程中阴极过电位影响因素研究进展  

Progress in Factors Study Affecting Deposition Overpotential During Copper Electrolysis

作　　者：陈正奎 

机构地区：[1]西藏玉龙铜业股份有限公司,西藏昌都854000

出　　处：《湖南有色金属》2015年第5期33-37,共5页Hunan Nonferrous Metals

摘　　要：铜电解沉积过程中,阴极过电位大小决定了铜结晶的粗细程度,高电流密度下提高高纯阴极铜产率,加强阴极过电位的控制非常关键。通过在铜电解过程中阴极过电位控制方面的研究工作,讨论了几种影响阴极过电位因素。以提高高纯阴极铜产率为目标,分析了电流密度、添加剂、阳极质量及电解液温度等因素对阴极过电位的作用机理,并讨论了各因素的影响规律。The deposition overpotential determines the copper crystallization grain degree in the copper electrolysis progress,and it is the key link to strengthen the control of cathodic overpotential in the high current electrolytic process. Combined with the research work about the control of cathodic overpotential done by the writers,the study progress of representative factors affecting the deposition overpotential is reviewed. Objective to increase the productivity rate of the high-purity cathode copper,the action mechanisms to the deposition overpotential of the current density,additive,anode quality and electrolyte temperature. etc were analyzed,and the influence law were also discussed.

关 键 词：铜电解 阴极过电位 阴极铜质量 研究进展 

分 类 号：TF111.52[冶金工程—冶金物理化学]