雾化室内气压对Sn_(0.3)Ag_(0.7)Cu焊锡粉末雾化过程的影响  

Effect of atomizing chamber pressure on the atomization process of Sn_(0.3)Ag_(0.7)Cu solder powder

作　　者：王子逾 赵麦群[1] 韩帅[1] 吴道子 赵振[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《粉末冶金工业》2015年第5期17-21,共5页Powder Metallurgy Industry

基　　金：陕西省教育厅重点实验室科研计划项目(14JS069)

摘　　要：利用超音速气雾化装置制备了Sn0.3Ag0.7Cu无铅焊锡粉末,研究了雾化室内不同气压状态对粉末雾化过程的影响。结果表明:随着雾化室内部气压的逐渐增大,锥形雾化区由稳定逐渐趋于紊乱,锥形雾化区范围逐渐变大,气液流量比也随之增大,粉末球形度先变好后变差。当雾化室内部气压为0.05 MPa时,锥形雾化区稳定且雾化区范围大,粉末球形度最好。The Sn0.3Ag0.7Cu lead-free solder powder was prepared with supersonic gas atomization device to study the effects of different pressure states inside the atomization chamber on the atomization process of powder. The re- sults show that conical atomization area tends to disorder from stable state with the atomizing chamber pressure in- creasing, moreover, the conical atomization area becomes larger gradually, gas-liquid flow ratio also increases, and the sphericity degree of atomized powder becomes better firstly and then worse. When the pressure inside the chamber is 0.05 MPa, the conical atomization area is stable and has large area, the sphericity degree of atomized powder is the best.

关 键 词：超音速气雾化Sn0.3Ag0.7Cu锥形雾化区 球形度 

分 类 号：TF123.2[冶金工程—粉末冶金]