随机振动加载条件下焊点形态参数对板级光互连模块对准偏移影响分析  

Effects of solder shape parameters on optical interconnection module alignment offset under random vibration loading

作　　者：黄春跃[1] 吴松[1] 梁颖[2] 李天明[3] 郭广阔[1] 熊国际 唐文亮[1] 

机构地区：[1]桂林电子科技大学机电工程学院,桂林541004 [2]成都航空职业技术学院电子工程系,成都610021 [3]桂林航天工业学院汽车与动力工程系,桂林541004

出　　处：《振动与冲击》2015年第19期198-202,共5页Journal of Vibration and Shock

基　　金：国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2012GXNSFAA05323;2013GXNSFAA019322);四川省教育厅科研资助项目(13ZB0052)

摘　　要：建立了光互连模块有限元分析模型并进行随机振动加载有限元分析,获取了垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)与耦合元件间的对准偏移;采用水平正交表设计了不同焊点结构参数组合并建立有限元模型,获取了对准偏移数据并进行方差分析。结果表明:在随机振动加载后,光互连模块VCSEL与耦合元件间会产生水平、垂直、轴向的偏移;陶瓷基板焊点高度、VCSEL焊点高度对对准偏移具有高度显著性影响;因素显著性排序由大到小依次为:陶瓷基板焊点高度、VCSEL焊点高度、陶瓷基板焊点体积和VCSEL焊点体积;单因子分析表明VCSEL与耦合元件对准偏移值随陶瓷基板焊点高度增加而增大,随VCSEL焊点高度增加而增大。A finite element model of optical interconnect module was established. The alignment offset between a VCSEL and coupled elements was obtained with the finite element analysis under random vibration loading. Different solder shape parameter combinations were designed with the horizontal orthogonal tables and used to establish a finite element model. The variance analysis was performed based on the alignment offset data of corresponding solder shape parameters. The results showed that random vibration loading causes horizontal,vertical and axial offsets between VCSEL and coupled elements; both the heights of ceramic substrate solder joint and VCSEL solder joint have a significant effect on the alignment offsets; the four factors are sorted in significance order descending form as follows： the height of ceramic substrate solder joint,the height of VCSEL solder joint,the volume of ceramic substrate solder joint and the volume of VCSEL solder joint; single factor analysis reveals the alignment offset increases with increase in the ceramic substrate solder joint height or the VCSEL solder joint height.

关 键 词：光互连模块 对准偏移 耦合效率 随机振动加载 有限元分析 

分 类 号：TN256[电子电信—物理电子学]