特殊晶体材料飞刀切削加工工艺的分析与优化  

Analysis and optimization of special crystal material fly cutting technology

作　　者：陈玲[1] 刘益嘉[1] 

机构地区：[1]北京工业大学机电学院,北京100124

出　　处：《制造技术与机床》2015年第11期139-144,共6页Manufacturing Technology & Machine Tool

基　　金：国家科技重大专项(2011ZX04004-042)

摘　　要：采用二次通用回归旋转组合设计方法,对KDP晶体的切削加工工艺进行优化设计;利用单点金刚石飞刀切削(single point diamond turning,SPDT)技术对其进行切削。对试验结果进行测量与分析,确定合理的试验因素及水平,分析加工工艺参数的单因素和交互因素对KDP晶体表面粗糙度的影响规律。最后得到最优工艺参数组合:刀具圆弧半径为5 mm,转速为800 r/min,进给量为1μm/r,背吃刀量为21μm,加工出的KDP晶体表面粗糙度值为0.017μm。KDP crystal cutting process is optimized through quadratic general regression rotary unitized design; KDP crystal cutting experiments are by means of single point diamond turning. The test results are meas- ured and analyzed to determine a reasonable level of experimental factors, analyze influence of single factor and interaction factor of process parameters on KDP crystal surface roughness. Finally, the opti- mal process parameters ： tool radius of 5 mm, speed of 800 r/ min, feed rate of 1 μm /r, back cutting depth of 21μm, then the machined KDP crystal surface roughness is 0. 017μm.

关 键 词：KDP晶体 单点金刚石飞刀切削 二次通用回归旋转组合试验 粗糙度 单因素 交互因素 

分 类 号：TH16[机械工程—机械制造及自动化]