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机构地区:[1]中国工程物理研究院电子工程研究所,绵阳621900
出 处:《中国陶瓷》2015年第10期29-33,共5页China Ceramics
基 金:中国工程物理研究院科学技术发展基金(2014A0302012)
摘 要:针对陶瓷成型工艺中出现的气孔缺陷,建立能准确描述陶瓷料浆充填过程的数学模型,以典型结构的A-95陶瓷试样为例,研究入口压力和尺寸对料浆充填流动过程的影响。通过对料浆充填流动过程的动态模拟分析,发现工艺参数不同时料浆充填过程有明显区别,对最终卷气分布有直接影响,其中低进口压力时底部涡旋区卷气严重,而高进口压力时最易发生卷气的区域则出现在中心圆弧处。Aiming at pore defect in the molding techniques of ceramic, a mathematical model was built which could describe accurately the forming process of ceramic slurry. Taking a typical A-95 ceramic part as example, influence of pouring size and pressure on forming process of slurry was investigated. Analysis results of dynamic simulation indicate that there existed much difference in slurry's flowing performance under different molding conditions, which could be connected to defects distribution in final products. Low pouring pressure probably would lead to serious pore defects in the bottom vortex region, and under high pouring pressure defects could emerge near the center arc region more likely.
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