钙调素修饰金电极的交流阻抗行为研究  

The AC Impedance Study of Calmodulin Modified on Au Electrode

作　　者：丁克强[1] 贺晓凌 王庆飞[2] 蒋殿录 白娟 童汝亭[2] 王心葵[3] 

机构地区：[1]1河北师范大学化学学院,石家庄050016 [2]河北师范大学化学学院,石家庄050016 [3]中国科学院山西煤炭化学研究所,太原030001

出　　处：《物理化学学报》2002年第8期741-745,共5页Acta Physico-Chimica Sinica

基　　金：河北省自然科学基金(298159)资助项目

摘　　要：利用交流阻抗方法,以Fe(CN)63-/Fe(CN)64-氧化还原对为探针,对自组装到金电极表面的钙调素(CaM)膜的成膜过程、不同pH值的影响以及与钙离子的结合情况进行了较系统的研究.实验结果表明,钙调素可以自组装到金电极表面并且其自组装过程较为明显地分为快、慢两个步骤;还发现钙调素膜的性能结构随体系不同的pH值发生有规律的变化,在其等电点,膜的结构最致密;而且钙调素膜与钙离子的结合也分为较明显的三个阶段.Calmodulin(CaM)as a major intracellular Ca 2+ receptor,was self-assembled on Au e lectrode and investigated by electrochemical im pedance spectroscopy(EIS).The results demonstrated that the s elf-assembly process of CaM could be divided into r apid and slow steps clearly.The influence of pH value on the new modified electrode was found to be re gular,and the most packed structure appeared at the calmodulin's iso-electric-point,the combining process of calmodulin with Ca 2+ was found to be composed of three stag es.In conclusion,our AC impedance study o f CaM is meaningful to reveal the mech anism of CaM in the real life system.

关 键 词：金电极 钙调素 自组装 pH值 钙离子 交流阻抗 修饰电极 电化学 信息传递 

分 类 号：O646[理学—物理化学]