聚(吡啶-酰亚胺)无胶覆铜板的制备和性能  

Preparation and Properties of Polyimdie Copper Clad Laminates Containing Diphenylpyridine

作　　者：姚海波[1] 金日哲[1] 康传清[1] 郭海泉[1] 邱雪鹏[1] 高连勋[1] 

机构地区：[1]中国科学院长春应用化学研究所高分子复合材料实验室,吉林长春130022

出　　处：《高分子材料科学与工程》2015年第10期115-119,共5页Polymer Materials Science & Engineering

基　　金：国家自然科学基金资助项目(51373164)

摘　　要：以联苯二酐(BPDA)和不同比例的2,5-二氨苯基吡啶(PRD)及二苯醚二胺(ODA)为单体,通过共聚的方法,制备了一系列聚酰胺酸(PPA);将其涂布于铜箔表面,高温热亚胺化后获得双层柔性覆铜板。研究了刚性二胺PRD和柔性二胺ODA的比例对聚酰亚胺薄膜热膨胀系数、双层覆铜板的尺寸稳定性以及薄膜与铜箔的粘接强度的影响,分析了含吡啶聚酰亚胺与铜箔的粘接机理。结果表明,当PRD/ODA的摩尔比为1∶1时,聚酰亚胺的热膨胀系数与铜箔相当,可与铜箔构成尺寸稳定的无胶挠性覆铜板;其与铜箔的粘接强度达到19.7N/cm。这种含吡啶聚酰亚胺的性能可以满足无胶挠性印制电路对基底膜材料的尺寸稳定性和粘接性能的要求。A series of poly（amic acid）s（PAAs）containing diphenylpyridine were synthesized from the reaction of 3,3′,4,4′-biphenyl tetracarboxylic dianhydride with 4,4-oxydianiline（ODA）and 2,5-bis（4-aminophenyl）pyridine（PRD）,followed by coating these PAAs solutions onto copper foils and then imidizing thermally.The dimensional stability and peel strength of the resulting two-layer flexible copper-clad laminates were characterized.It is found that when the mole ratio of PRD to ODA is 1∶1,the coefficient of thermal expansion（CTE）values of the polyimide（PI）is close to the value of the copper foil,and the 90°-peel strength of the laminate reaches the maximum value of 19.7N/cm.Hence,the physical properties of polyimide containing PRD could match simultaneously requirement of curl-free polyimide/copper laminate in dimensional stability and adhesion properties.

关 键 词：聚酰亚胺 二苯基吡啶 粘接强度 柔性覆铜板 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]