烧结温度对AuSn焊料薄膜及封装激光器性能的影响  

Effects of the Sintering Temperature on the Performance of AuSn Solder Film and Packaged Laser

作　　者：杨扬[1,2] 孙素娟 李沛旭 夏伟 徐现刚[1,2] 

机构地区：[1]山东大学晶体材料国家重点实验室,济南250100 [2]山东华光光电子有限公司,济南250100

出　　处：《半导体技术》2015年第11期840-845,共6页Semiconductor Technology

摘　　要：采用不同温度对Au80Sn20共晶合金焊料进行烧结实验,研究了Au Sn焊料薄膜在烧结后的形貌、物相组成以及对封装激光器的性能影响等。焊料在烧结后形成ζ相Au5Sn和δ相Au Sn两种金属间化合物,随着烧结温度的上升,两相晶粒均明显长大,而ζ相Au5Sn趋向于形成枝晶。较低温度下烧结的焊料表面粗糙度较高,不利于激光器管芯的贴装。高温过烧焊料薄膜的导电导热性能有少许提升,对封装激光器管芯的功率没有明显影响,但焊料薄膜中残余应力较高,使激射波长有所蓝移。该结果将为Au Sn焊料的烧结参数优化和硬焊料封装激光器的性能分析提供参考和指导。Au80Sn20eutectic solder films were sintered under different temperatures,whose morphology,phase composition and impact on the performances of the packaged laser were researched. After sintering,the solder composes of two intermetallic compounds, the ζ phase Au5 Sn and δ phase Au Sn. With the rise of the sintering temperature,both grains of the two phases grow significantly,and the ζ phase Au5 Sn tends to form dendrites. The solder surface roughness was high with the lower sintering temperature,which was adverse to the package of laser chips. The overburnt solder film under high temperature shows a little better electric and thermal conductivity,with no significant effect on the power of the packaged laser. However,higher residual stress in the overburnt solder impacts on the lasing wavelength,which shows a slight blueshift. These results will supply references for the optimization of the sintering of the Au Sn solder and the package of the laser by hard solder.

关 键 词：激光器 金锡焊料 烧结 温度 金属间化合物 

分 类 号：TN305.94[电子电信—物理电子学]