单激光器剥线平台设计和工艺参数研究  

Design and Process Parameters Research of Single-laser Stripping Platform

作　　者：杜秋[1] 杨桂林[1] 王明娣[1] 石世宏[1] 孙立宁[1] 杭小林 汤攀飞 

机构地区：[1]苏州大学机电工程学院,江苏苏州215021

出　　处：《应用激光》2015年第5期578-582,共5页Applied Laser

基　　金：国家自然科学基金资助项目(项目编号:51205266);苏州市工业应用基础研究计划资助项目(项目编号:SYG201326)

摘　　要：对于极细线,机械式剥线方式已无法满足要求,而激光剥线易于与电子设备集成及可控性高,已经得到广泛应用,目前主要采用两个激光器进行导线剥离,该方法成本较高。研究设计了一种基于自动双工位翻转机构的单激光器剥线平台,通过双工位翻转即可实现导线的双向剥离。和现有的双头激光器的导线剥离相比,虽然完成一排导线的剥离时间略长,但仍然能满足剥线产量要求,且剥离质量与双头激光器相当。与双头激光器相比,剥线成本缩小了一半,对于中小型企业是较理想的选择,并在此设备上对手机天线进行了剥线研究,得出不同工艺参数对剥线质量的影响规律,获得剥离手机天线的最佳工艺参数。It is obvious that mechanical stripping is unable to meet the requirements for the stripping of extremely thin wires. Laser stripping has been widely used for its easy integration with electromechanical equipment and high controllability. Currently most laser stripping devices have to utilize double lasers, resulting in high-cost. To solve this problem, a single-laser stripping platform based on automatic double-position flipping is designed. This platform can realize bi-direetional stripping with only one laser through automatic double-position flipping. Compared with double-laser stripping platform, the single-laser one can meet the requirements of stripping production with slightly longer stripping time per row of wires but is only half the cost and of the same stripping quality, making it ideal for most medium and small companies. Research has been done on this device of mobile phone antenna stripping. The influence of different process parameters on the stripping quality and the optimal process parameter has been obtained.

关 键 词：激光剥线 翻转平台 双向剥离 工艺参数 

分 类 号：O439[机械工程—光学工程]