Mo含量对Cu-Ni-Mo合金组织及导热性能的影响  

Effects of Mo Content on Microstructure and Thermal Conductivity of Alloy Cu-Ni-Mo

作　　者：方玉峰[1] 卢百平[1] 

机构地区：[1]南昌航空大学轻合金加工科学与技术国防重点学科实验室,江西南昌330063

出　　处：《铸造技术》2015年第10期2391-2393,共3页Foundry Technology

基　　金：国家863计划资助项目(2013AA064001)

摘　　要：采用真空高频感应熔炼工艺制备了Cu-Ni-Mo合金,研究了Mo含量对合金组织、导热率和熔点的影响。结果表明,随着Mo含量的增加,合金晶粒变得更细小,并且合金中第二相含量先增加后减少。合金的导热率随着Mo含量的增加先升高后降低,Cu20Ni-3Mo合金的导热率最高,为35.875 W/m·k。合金的熔点随着Mo含量的增加而升高,但是变化不大。The alloys Cu-Ni-Mo were prepared using vacuum high-frequency induction melting process,and the effect of Mo content on the microstructure,thermal conductivity and melting point of the alloy Cu-Ni-Mo was investigated.The results show that the grain of the alloy becomes finer with the increase of Mo content,and the content of the second phase in the alloy increases first and then decreases.The thermal conductivity of the alloy Cu-Ni-Mo also increases first and then decreases,and thermal conductivity of the alloy Cu-20Ni-3Mo（35.875 W/m·k） is maximal.The melting point of the alloy Cu-Ni-Mo increases with the increase of the Mo content,but the changes are not significant.

关 键 词：Cu-Ni-Mo合金 显微组织 导热率 熔点 

分 类 号：TF133[冶金工程—冶金物理化学] TG146.11[一般工业技术—材料科学与工程]