电镀前处理对电镀铜柱均匀性改善的研究  

Effects of plating pretreatment on the uniformity of electroplating copper pillars

作　　者：向静 陈苑明[1] 何为[1] 陈先明 宝玥 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]珠海越亚封装基板技术有限公司,广东珠海519175

出　　处：《印制电路信息》2015年第A01期132-138,共7页Printed Circuit Information

基　　金：文章得到广东省科技项目的资助

摘　　要：无核封装基板制造的核心技术是以图形电镀方式实现精细线路和铜柱的制作，而具有良好电镀均匀性的铜柱才能保证层间互连的可靠性。文章研究了电镀前处理条件改变对电镀铜柱均匀性的影响，并对其机理进行了分析。实验结果表明了除油时间延长至1000s与增加电镀前的等离子蚀刻（plasma）处理可以有效地将65um车同柱厚度的标准偏差降低到2．66，极值降低到12．3μm，其原因是延长除油时间可改善铜面粗糙度，plasma处理提高干膜表面的浸润性且进一步增加铜面粗糙度，从而促进电镀过程中镀液的快速交换，有利于铜柱的均匀性电镀。Copper pillars and fine lines from pattern plating are one key technology for the manufacture of coreless package substrate. Uniform copper pillars could lead to the reliability of interconnection between layers. Effects of plating pretreatment on electroplating copper pillars were investigated to realize the plating uniformity. Mechanism of plating pretreatment was also analyzed. The degreasing time of 1000s and the addition of plasma treatment could effectively reduce the standard deviation to 2.66 and extreme value to 12.3~tm for plating copper pillars since increasing the roughness of copper surface from degreasing time and improving the wettability and the roughness of copper surface of dry film from plasma treatment could accelerate the exchange of plating solution during copper electrodepositon.

关 键 词：电镀除油 等离子均匀性 

分 类 号：TN41[电子电信—微电子学与固体电子学]