铜/环氧复合材料导热性能的三维数值模拟研究  

THREE-DIMENSIONAL NUMERICAL SIMULATION RESEARCH OF THERMAL CONDUCTIVITY OF Cu / EP COMPOSITE

作　　者：陆曼[1] 鲍睿[1] 晏石林[1] 邵世东[2] 

机构地区：[1]武汉理工大学,武汉430070 [2]中国电子科技集团公司第三十八研究所,合肥230088

出　　处：《玻璃钢／复合材料》2015年第11期9-14,共6页Fiber Reinforced Plastics/Composites

基　　金：国家科技支撑计划(2015BAB07B04)

摘　　要：通过数值模拟手段研究了铜/环氧树脂复合材料的导热性能。利用ANSYS/APDL参数化有限元分析技术,建立了铜颗粒随机分布的三维模型,研究了模型尺寸、铜颗粒的体积分数、粒径分布、颗粒尺寸、颗粒形貌以及颗粒在基体中的排列方式对导热系数的影响。模拟结果表明,当导热模型边长大于100μm时,复合材料的导热系数趋于稳定;铜/环氧复合材料导热系数随铜颗粒体积分数的增加而增加,且增加的幅度越来越大;填充相同粒径的颗粒和粒径服从正态分布的颗粒,材料的导热系数基本保持一致;复合材料的导热系数随颗粒尺寸的变化而波动;方形填料比球形填料更能提升材料的导热性能;填料在基体中排列方式不同,导热系数也不相同,填料沿热流方向定向排列时,增强作用显著。Thermal conductivity of Cu/EP composite was studied by numerical simulation method. A 3D model of particles random distribution was established by ANSYS/APDL parametric finite element analysis technology. The effect of model size, volume fraction, single particle size or normal distribution particle sizes, particle shape, parti- cle size and particles distribution on thermal conductivity of Cu/EP composites were investigated. The simulation re- sults show that when the length of thermal conductivity model is greater than 1001~m, the thermal conductivity is close to stabilization. Thermal conductivity of Cu/EP composite increases with volume fraction, and the magnitude of increase becomes bigger and bigger. Filling same particle size particles and normal distribution particle sizes parti- cles, thermal conductivities of them keep pace with each other. Particle size has effect on thermal conductivity, and the change law is not monotonous increasing or decreasing. Cube fillers enhance the performance of thermal conduc- tivity better than sphere fillers. The thermal conductivity will be different for different particles distribution in the matrix. When the particles are arranged along the direction of heat flow, the enhancement is significant

关 键 词：铜 环氧树脂 导热系数 有限元分析 

分 类 号：TB332[一般工业技术—材料科学与工程]