低气压下藕状多孔铜的结构控制与研究  

Control and Study of Lotus-Type Copper Structure under Low Pressure

作　　者：卫真真 金青林[1] 李再久[1] 蒋业华[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《稀有金属》2015年第11期993-997,共5页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(51164018)资助

摘　　要：采用金属-气体共晶定向凝固技术,利用自行研制的Gasar模铸装置,在保温温度为1456 K,氢气压分别为0.04,0.07,0.10 MPa的工艺条件下,成功制备出了直径为Ф100 mm,高度为150 mm的藕状多孔铜试样(气孔率分别为:23.1%,38.5%,48.2%)。在线切割机上将所制备的试样分别沿纵向和不同高度处切开,利用扫描仪和Image J软件对试样照片和气孔率进行采集、统计,研究了低气压下藕状多孔铜气孔和气孔率的分布。结果表明:在低气压(小于0.2 MPa)下,保温温度相同时,随着气压的升高,气孔率升高,气孔孔径也相应地增大,当气压为0.1 MPa时,气孔率增加至48.2%,气孔平均孔径增加至524μm;同一试样,随着试样高度的增加,气孔率呈现先略微增加后减小的趋势,在试样高度约为50 mm处,气孔率达到最大值,这与中高气压下藕状多孔铜气孔和气孔率的分布有所不同,进一步丰富了气压对藕状多孔铜气孔结构影响的理论和实验研究。A mold casting technique was developed to fabricate lotus-type porous metals. Lotus-type porous Cu （diameter of 100 ram, height of 150 ram） was successfully fabricated by metal-gas eutectic unidirectional solidification technique under hydrogen gas pressure of 0.04, 0.07 and 0.10 MPa at the holding temperature of 1456 K, and the porosities were 23.1% , 38.5% , and 48.2% , respectively. The samples were cut along the longitudinal incision and different heights by line cutting machine, and the sample photos and porosity were obtained by the scanner and Image J software. The effect of pressure on the lotus-shape porous Cu structure was stud- ied. It showed that for porous Cu under a low pressure （ less than 0.2 MPa） , an increased pressure would result in an increased porosi- ty and an increased average pore diameter; when the pressure was 0.1 MPa, the porosity increased to 48.2% and the average pore di- ameter increased to 524 μm; for the same sample, the porosity exhibited a change that increased slightly first and then decreased with the sample height increasing, and the porosity reached maximum at the height of about 50 mm. However, the distribution of pore and porosity for the lotus-type porous copper under high pressure were different, which further enriched the theoretical and experimental research about the effect of pressure on the porosity structure of lotus-type porous copper.

关 键 词：定向凝固 藕状多孔铜 气孔率 低气压 

分 类 号：TG146[一般工业技术—材料科学与工程]