Cu/Al_2O_3与Cu/AlN复合陶瓷基板材料制备研究  

Study of Cu/Al_2O_3 and Cu/AlN Composite Ceramic Substrate Materials

作　　者：谢建军[1] 王亚黎[1] 施誉挺 李德善 丁毛毛 翟甜蕾 章蕾[1] 吴志豪 施鹰[1] 

机构地区：[1]上海大学材料科学与工程学院电子信息材料系,上海200444 [2]上海申和热磁电子有限公司,上海200444

出　　处：《陶瓷》2015年第11期31-35,共5页Ceramics

基　　金：上海市宝山区科委产学研项目(项目编号:bkw2014124);上海市科研计划能力建设项目(项目编号:14520500300)

摘　　要：利用直接敷铜(DBC)技术制备了Cu/Al2O3、Cu/AlN复合陶瓷基板材料。通过机械剥离机和场发射扫描电子显微镜分析了Cu/Al2O3、Cu/AlN复合陶瓷基板材料的结合力、界面微观形貌与元素分布。结果表明,在Cu箔能与Al2O3基板直接结合,而AlN组需要预氧化然后才能与Cu箔紧密结合,Cu箔与Al2O3、预氧化AlN基板间的结合力均超过8N/mm。通过EDS能谱分析,在Cu箔与预氧化AlN基板间出现组分主要为Al2O3和CuAlO2的过渡层。In the paper, Cu/Al2O3 and Cu/AlN composite ceramic substrate materials were fabricated successfully by direct bonded copper （DBC） process, in -1060℃ and O2/N2 atmosphere. The bonding strength of Cu foil and Al2O3 , AlN ceramic substrates tested by mechanic testing equipment was more than 8.0 N/ram. The microstructure of Cu/Al2O3 and Cu/ AlN composite ceramic substrate materials interface was investigated by SEM and microscope. The results show that there are Al2O3 and CuAlO2 produced in the interface of Cu/AlN composite ceramic substrate materials. The bonding temperature has some influence on Cu/Al2O3 and Cu/AlN interface strength.

关 键 词：直接敷铜 Cu/Al2O3 Cu/AlN 界面结合力 界面微观形貌 

分 类 号：TM28[一般工业技术—材料科学与工程]