珍珠镍电镀工艺优化及镀层性能分析  

Optimization of pearl nickel plating process and analysis on properties of the deposit

作　　者：何湘柱[1] 曹香雄 谢金平 曾振欧 秦华[1] 

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]广东致卓精密金属科技有限公司,广东佛山528247

出　　处：《电镀与涂饰》2015年第21期1219-1225,1273,共7页Electroplating & Finishing

摘　　要：采用正交试验方法研究了珍珠镍电镀液配方与工艺参数,获得了最佳的镀液组成和工艺条件:NiSO4_·6H_2O 400 g/L,NiCl_2·6H2O 35 g/L,H_38O_3 40 g/L,柔软剂BSI 24.0 mL/L,润湿剂MA-80 1.0 mL/L,沙剂TB 5.6 mL/L,稳定剂PVA-124 2.4 mL/L,温度55℃,pH 4.0,阴极移动速率4次/s,阴极电流密度6 Adm^2,电镀时间5 min。采用扫描电镜、x射线荧光测厚仪、显微硬度计、中性盐雾试验等方法测试了优化条件下所得镀层的性能,并与现有的HN-80工艺进行了对比。研究开发的珍珠镍电镀工艺起沙快,电流密度范围宽,所得镀层外观为银白色,沙感强,镀层凹坑直径在3~10μm之间,但其硬度和耐蚀性能低于HN-80工艺所得镀层。The bath formulation and process parameters of pearl nickel plating were optimized by orthogonal test as follows： NiSO4·6H2O 400 g/L, NiCl2·6H2O 35 g/L, H3BO3 40 g/L, softening agent BS124.0 mL/L, wetting agent MA-80 1.0 mL/L, satin agent TB 5.6 mL/L, stabilizer PVA-124 2.4 mL/L, temperature 55 ℃, pH 4.0, cathode moving speed 4 times/s, cathodic current density 6 A/dm2, and plating time 5 rain. The properties of the deposit obtained under the optimized conditions were examined by scanning electron microscopy （SEM）, X-ray fluorescence thickness meter, microhardness tester, and neutral salt spray test, and compared with that of the deposit produced by current HN-80 process. The developed pearl nickel plating process has fast satin speed and wide satin current density, and the deposit presents a silvery appearance and a strong satin effect with a recess diameter in range of 3-10 gm, while its hardness and corrosion resistance are lower than that of the deposit obtained by the HN-80 process.

关 键 词：珍珠镍电镀 赫尔槽 正交试验 优化 外观 

分 类 号：TQ153.12[化学工程—电化学工业]