LTE230无线通信基带芯片的设计与应用  

Design and application of baseband chip for LTE230 wireless communication

作　　者：周春良 张峰[2] 程伦 樊文杰 王连成 周芝梅 唐晓柯 

机构地区：[1]北京南瑞智芯微电子科技有限公司,北京100192 [2]苏州供电公司,江苏苏州215004 [3]昆山市供电公司,江苏昆山215300

出　　处：《电子技术应用》2015年第12期48-50,共3页Application of Electronic Technique

摘　　要：在分析LTE230电力无线通信系统的基础上,针对当前LTE230终端平台存在的问题,设计出一种新型的高性能、低成本、低功耗的LTE230无线通信基带芯片。文章详述了该芯片的结构及其关键技术,并结合智能电网配用电业务带宽需求的2种典型应用场景,提出了基于该芯片的终端实现方案。Based on the analysis of LTE230 electric power wireless communication system,a new type of high performance , low cost and low power baseband chip for LTE230 wireless communication is designed aiming at the existing problem of current LTE230 terminal platform. The chip structure and key technology are described in detail, and combined with the two type typical application scenarios of bandwidth requirement for power distribution and utilization business in smart grid, a terminal implementation solution based on this chip is provided.

关 键 词：LTE230 基带芯片 LTE通信模块 用户终端设备 

分 类 号：TN492[电子电信—微电子学与固体电子学]